16700 Trans Canada Highway Kirkland, Quebec, Canada info@taskmicro.com (514) 697-6616

Achievements

For over 3 decades, TASK has been a leader in the development of advanced microelectronics assemblies.

Some examples of our achievements and projects we have worked on:

3D stacked chip for a digital hearing amplifier hybrid

Flip chip on chip stacked on capacitors then mounted on ceramic.

World’s smallest medical imager

Multiple substrates incorporated into a 3 dimensional assembly using a ceramic substrate with flex connectors and a wire bonded die.

Ingestible pH sensor with RF transmission

Double sided SMT assembly on FR4 with soldered batteries.

Autoclavable surgical navigation device

Fully potted assembly consisting of two boards – A switch board on ceramic with push button attached switches that is parylene coated and a Motor Drive Board – a double sided SMT on FR4.

Continuous Glucose Monitoring Systems (CGM) with implantable sensor assembly

Chip on chip then a chip on board. Technologies used: - Thermal sonically attached LED to ASIC - Gold stud bump, flip chip to substrate - Fully encapsulated

Lens control Electronics for Eyewear

Very thin double sided SMT FR4 board assemblies, fully potted and integrated into the frame of the glasses.

Custom wrap around / Castellation thick film printing

Conductive edge printing on a variety of ceramic base substrates – all done in house at Task.

Endoscope Assembly

SMT assembly on FR4 with custom pin out and CMOS.

Prosthetic Bionic Knee Assembly

High density SMT assemblies on FR4 with under filled BGA, then conformal coated.

LIDAR Assembly for Autonomous Vehicle

Chip on board with wire bonding and selective glob top coverage with critical keep out areas.

Multi Module Lens Assembly – Borescope Inspection Tools

Multi module hybrid assemblies that include both ceramic and flex options both with die attach.

Optical Encoders for Motion Control

Variety of products that are FR4, ceramic and HTCC Based. These devices include embedded IC’s, high precision VCEL attach with wire bonding and encapsulation.

Thick Film Industrial Sensors and Accelerometers to measure pressure and force

Ceramic base thick film hybrids that include standard SMT to die attach and wire bonding.

Blast Impact Sensor

Double sided SMT on FR4 rigi flex with custom micro SD card attach.

Wild Life Tracking Devices

Flex assembly with double sided flip chip and etch pin assembly.

Achievements

For over 3 decades, TASK has been a leader in the development of advanced microelectronics assemblies.

Some examples of our achievements and projects we have worked on:

TASK continues to push boundaries while helping our customers with solutions to their technical challenges

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