16700 Trans Canada Highway Kirkland, Quebec, Canada info@taskmicro.com (514) 697-6616


Microelectronic Manufacturing Services and Capabilities

TASK works with numerous substrates and a wide variety of component mounting and multi-process assembly technologies, including die placement & wire bonding.

Our team has extensive experience in producing complex and custom devices, where restrictions present obstacles to our customers.

Microelectronic manufacturing is our specialty. Let Task ensure optimal product manufacturability.

Manufacturing Capabilities:

Task Micro
Wire bonding
  • Thin to Heavy Gauge Wire Bonding
  • Gold Wire Bonding
  • Aluminum Wire Bonding
  • 0.7 mil to 2 mil Ball Stitch Au Bonding
  • 0.7 mil-1.3 Au / 1.1 Al Wedge Bonding
  • 5.6-1.5 (15) mil Heavy Gauge AL or Cu Bonding
  • Reverse Bonding
  • Automatic Gold Stud Bumping and Coining
  • Ball and Wedge Wire Bonding
  • Deep Access Wire Bonding
Task Micro
Die placement, attach and configuration
  • Chip on Board
  • Flip Chip
  • Manual and Automatic Die Attach – Placement accuracy down to 10 µm
  • Conductive and non-conductive epoxy gluing with wire bonding
  • Die placement on numerous substrates, including, but not limited to:
    • FR4
    • Flex
    • Ceramic
    • Glass
    • IMS
    • Kapton
    • AIN
TASK considers our ability to adapt and develop new processes and capabilities as a critical strength in providing innovative solutions to our customer’s technical challenges.


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