16700 Trans Canada Highway Kirkland, Quebec, Canadainfo@taskmicro.com(514) 697-6616

Manufacturing

Manufacturing Capabilities

TASK works with numerous substrates and a wide variety of component mounting and multi-process assembly technologies.

Our team has extensive experience in producing complex and custom devices, where restrictions present obstacles to our customers.

Manufacturing Services at TASK

Task Micro
DIE ATTACH AND CONFIGURATION
Flip-chip, conductive and non-conductive epoxy gluing, UnderFill and wire bonding
Manual/Automatic Die attach – Placement accuracy down to 10 µm
Substrates include, but not limited to: FR4, Flex, Ceramics, Glass, IMS, Kapton, AlN, Ferrite etc...
Task Micro
SMT
Fully automated SMT Lines
Placement of 01005
Task Micro
WIRE BONDING
0.7mil to 2mil
0.7mil – 1.3 /1.1 Al
5.6 – 15mil
Reverse bonding
Automatic gold stud bumping and coining
TASK considers our ability to adapt and develop new processes and capabilities as a critical strength in providing innovative solutions to our customer’s technical challenges.